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  • MECHANIC Solder Paste Flux XG-50 Sn63/Pb67 SMD SMT For 936 852D+ BGA Soldering Iron Station Repair Welding Tool  Инструменты
  • MECHANIC Solder Paste Flux XG-50 Sn63/Pb67 SMD SMT For 936 852D+ BGA Soldering Iron Station Repair Welding Tool  Инструменты
  • MECHANIC Solder Paste Flux XG-50 Sn63/Pb67 SMD SMT For 936 852D+ BGA Soldering Iron Station Repair Welding Tool  Инструменты

MECHANIC Solder Paste Flux XG-50 Sn63/Pb67 SMD SMT For 936 852D+ BGA Soldering Iron Station Repair Welding Tool Инструменты - купить

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Купить MECHANIC Solder Paste Flux XG-50 Sn63/Pb67 SMD SMT For 936 852D+ BGA Soldering Iron Station Repair Welding Tool | Инструменты

MECHANIC Solder Paste Flux XG-50 Sn63/Pb67 SMD SMT For 936 852D+ BGA Soldering Iron Station Repair Welding Tool  ИнструментыMECHANIC Solder Paste Flux XG-50 Sn63/Pb67 SMD SMT For 936 852D+ BGA Soldering Iron Station Repair Welding Tool  ИнструментыMECHANIC Solder Paste Flux XG-50 Sn63/Pb67 SMD SMT For 936 852D+ BGA Soldering Iron Station Repair Welding Tool  Инструменты MECHANIC Solder Paste Flux XG-50 Sn63/Pb67 SMD SMT For 936 852D+ BGA Soldering Iron Station Repair Welding Tool 

1.Mechanic Soldering Solder Welding Paste.

2.It use new technical support, the unique chemical formulations provide excellent wetting, ensuring high reliability.

3.Efficient use of the thixotropic agent, can effectively prevent the collapse of the solder printing and special preheating the printing and to ensure good fine pattern.

4.Because use more advanced insulation technology, tack lasting, so it is easy to dry, sticky lasted more than 48 hours.

5.High quality and unique formula, perfect performance, easy to weld, solder bright and full, no solder false phenomena.

6.The residue was colorless and transparent, does not affect the excellent detection, disposable and cleaning performance.

7.Product moist and good, strong anti-dry at room temperature shelf life longer, adapted to mobile phone repair industry, digital computer repair industry, high-precision circuit board SMT soldering, BGA soldering process so.


Specification:
Product:XG-50

Alloy:Sn63/Pb37

Microns: 25-45um

Hi-Preformance

No-Clean

Storage Condition:0-10°c

Weight: 70g

 

Note:

1. Harmful by inhalation and if swallowed.

2. Danger of cumulative effects.

3. Keep away from food,drink and animal feeding stuffs.

4. When using do not eat,Drink or smoke.

5. Avoid prolonged or repeated contact of any skin with solder paste. In case of solder         paste ingestion see a doctor immediately.

6.Store container welll closed and cooldshrase HTB1v6ZmOpXXXXcEXFXXq6xXFXXXA.

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