DM-200-BU BURNLEY BGA Reballing Soldering Flux Paste 100g free shipping Инструменты - купить

Купить DM-200-BU BURNLEY BGA Reballing Soldering Flux Paste 100g free shipping | Инструменты

DM-200-BU BURNLEY BGA Reballing Soldering Flux Paste 100g Reballing Paste DM-200-BU 100g Soldering free shipping

Wholesale BURNLEY BGA solder paste lead-free environmental protection solder paste DM-200-BU solder paste
US Burnley Solder Paste for mobile phone PCB, BGA and PGA and other SMD repair repair solder paste, which is used in the low ionic activator system, Run tin fast, low degree of smoke, the residue after curing the surface insulation Impedance is very high, therefore, mobile phones and other communications products, the electrical interference is very small DM-200 for the moderate activity of rosin-type solder paste, widely used mobile phone SMD rework process
Suitable for north and south bridge, video card, mobile phone chip, video game BGA chip welding, planting ball, but also do the use of tin, the effect is very good, is definitely your choice of residue less solder bright, no smoke, Do not miss the ball
Applications:
Applicable to sensors, wire, motor, fuse, connector, metal shell, lighting, electronic components, S M T repair, BGA chip ball, etc.
Model: DM-200
Packing: 100 grams per bottle